I-SAMSUNG iceba ukuphinda kathathu umthamo wayo wokufunyanwa kwetshiphu ngo-2027

UJeong Ki-tae, usekela mongameli wophuhliso lobuchwepheshe kwiyunithi yoshishino lwenkampani, uthe i-Samsung Electronics ivelise ngempumelelo i-chip ye-3-nanometer esekelwe kwi-teknoloji ye-GAA okokuqala ngqa emhlabeni kulo nyaka, kunye ne-45 yepesenti yokusetyenziswa kwamandla aphantsi, i-23 yepesenti yokusebenza ephezulu kunye ne-16 ekhulwini ngaphantsi kwendawo xa kuthelekiswa ne-5-nanometer chip.

I-Samsung Electronics nayo iceba ukungakhathaleli umzamo wokwandisa umthamo wemveliso ye-chip Foundry yayo, ejolise ngaphezu kwesithathu amandla ayo okuvelisa ngo-2027. Ukuza kuthi ga ngoku, i-chipmaker ilandela isicwangciso "seqokobhe lokuqala", esibandakanya ukwakha igumbi elicocekileyo kuqala kwaye emva koko usebenze indawo eguquguqukayo njengoko imfuno yemarike ivela.

UChoi Si-young, umongameli wecandelo leshishini le-Samsung Electronics, uthe, "Sisebenza kwiifektri ezintlanu eKorea nase-United States, kwaye sikhusele iziza zokwakha iifektri ezingaphezu kwe-10."

I-IT House ifunde ukuba i-Samsung Electronics iceba ukuqalisa inkqubo ye-3-nanometer yesizukulwana sesibini kwi-2023, iqalise ukuveliswa kobuninzi be-2-nanometer kwi-2025, kwaye iqalise inkqubo ye-nanometer ye-1.4 kwi-2027, i-teknoloji yendlela ye-teknoloji leyo i-Samsung yaqala ukuyichaza eSan Francisco ngo-Oct. 3 (ixesha lendawo).