I-SAMSUNG iceba ukuphinda kathathu umthamo wayo wokufunyanwa kwetshiphu ngo-2027

UJeong Ki-tae, usekela mongameli wophuhliso lwetekhnoloji kwiyunithi yeshishini le-Foundry yenkampani, uthe i-Samsung Electronics ivelise ngempumelelo i-chip ye-3-nanometer esekelwe kubuchwephesha be-GAA okokuqala emhlabeni kulo nyaka, kunye ne-45 yepesenti yokusetyenziswa kwamandla aphantsi, Iipesenti ze-23 eziphezulu zokusebenza kunye neepesenti ze-16 indawo encinci xa kuthelekiswa ne-5-nanometer chip.

I-Samsung Electronics nayo iceba ukubamba umzamo wokwandisa umthamo wemveliso ye-chip Foundry yayo, ejolise ngaphezu kokuphindwe kathathu umthamo wayo wemveliso ngo-2027. igumbi licoceke kuqala kwaye emva koko usebenze indawo ngokuguquguqukayo njengoko imfuno yemarike iphakama.

UChoi Si-young, umongameli wecandelo leshishini le-Samsung Electronics, uthe, "Sisebenza kwiifektri ezintlanu eKorea nase-United States, kwaye sikhusele iziza zokwakha iifektri ezingaphezu kwe-10."

I-IT House ifunde ukuba i-Samsung Electronics iceba ukusungula inkqubo yesizukulwana sesibini se-3-nanometer ngo-2023, iqalise ukuveliswa kobuninzi be-2-nanometer ngo-2025, kwaye iqalise inkqubo ye-nanometer ye-1.4 ngo-2027, imephu yetekhnoloji eyavezwa okokuqala yi-Samsung eSan. UFrancisco ngo-Oktobha 3 (ixesha lendawo).