I-MLPF-WB55-02E3 i-Signal Conditioning 2.4 GHz ehambelana netshiphu yeqabane lokucoca i-STM32WB55Vx
♠ Inkcazo yeMveliso
| Uphawu lweMveliso | Ixabiso lophawu |
| Umenzi: | I-STMicroelectronics |
| Udidi lweMveliso: | Ukumiswa koMqondiso |
| RoHS: | Iinkcukacha |
| Uhlobo lweMveliso: | Ukumiswa koMqondiso |
| Ukupakishwa: | I-Reel |
| Ukupakishwa: | Sika iTape |
| Ukupakishwa: | MouseReel |
| Uphawu: | I-STMicroelectronics |
| Ubungakanani bePakethi yoMzi-mveliso: | 5000 |
| Uluhlu olungaphantsi: | Izihluzi |
| Ubunzima beyunithi: | 0.000055 oz |
♠ 2.4 GHz isihluzi sokupasa esisezantsi sifaniswe ne-STM32WB55Vx
I-MLPF-WB55-02E3 idibanisa i-impedance ehambelana nenethiwekhi kunye nesihlungi se-harmonics. Uthungelwano lwe-impedance oluhambelanayo lwenzelwe ukwandisa ukusebenza kweRF ye-STM32WB55Vx. Esi sixhobo sisebenzisa iteknoloji ye-IPD ye-STMicroelectronics kwi-non-conductive glass substrate eyenza ukuba ukusebenza kwe-RF kulunge ngakumbi.
• I-impedance edibeneyo ehambelana ne-STM32WB55Vx
• I-LGA iyahambelana
• 50 Ω uthintelo lwegama kwicala le-eriyali
• Isihluzo se-harmonics esichasayo nzulu
• Ilahleko yokufaka ephantsi
• Umkhondo omncinci
• Ubukhulu obuphantsi ≤ 450 μm
• Ukusebenza okuphezulu kweRF
• I-RF BOM kunye nokunciphisa indawo
• Icandelo elithobelayo le-ECOPACK2
• IBluetooth 5
• I-OpenThread
• Zigbee®
• IEEE 802.15.4
• Ilungiselelwe i-STM32WB55Vx
